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Proceedings Paper

Integrated applications of inspection data in the semiconductor manufacturing environment
Author(s): Kenneth W. Tobin; Thomas P. Karnowski; Fred Lakhani
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Paper Abstract

As integrated circuit fabrication processes continue to increase in complexity, it has been determined that data collection, retention, and retrieval rates will continue to increase at an alarming rate. At future technology nodes, the time required to source manufacturing problems must at least remain constant to maintain anticipated productivity as suggested in the International Technology Roadmap for Semiconductors. Strategies and software methods for integrated yield management have been identified as critical for maintaining this productivity. Integrated yield management must use circuit design, visible defect, parametric, and functional test data to recognize process trends and excursions so that yield-detracting mechanisms can be rapidly identified and corrected. This will require the intelligent merging of the various data sources that are collected and maintained throughout the fabrication environment.

Paper Details

Date Published: 5 June 2001
PDF: 10 pages
Proc. SPIE 4275, Metrology-based Control for Micro-Manufacturing, (5 June 2001); doi: 10.1117/12.429361
Show Author Affiliations
Kenneth W. Tobin, Oak Ridge National Lab. (United States)
Thomas P. Karnowski, Oak Ridge National Lab. (United States)
Fred Lakhani, International SEMATECH (United States)


Published in SPIE Proceedings Vol. 4275:
Metrology-based Control for Micro-Manufacturing
Kenneth W. Tobin; Fred Lakhani, Editor(s)

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