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Proceedings Paper

Advanced defect-detection methods for CMP process modules in semiconductor manufacturing
Author(s): J. Scott Steckenrider; Rick Foster; Sumit Guha; Younsoo Ra; Hawk Kim; Anantha Sethuraman
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Paper Abstract

A comprehensive defect analysis scheme has been described here incorporating defect monitoring, classification and review tools. The integration scheme is presented pictorially, and described in detail in the body of this paper. This paper will also describe CMP defects gathered using this new defect detection methodology.

Paper Details

Date Published: 5 June 2001
PDF: 12 pages
Proc. SPIE 4275, Metrology-based Control for Micro-Manufacturing, (5 June 2001); doi: 10.1117/12.429353
Show Author Affiliations
J. Scott Steckenrider, Cabot Microelectronics Corp. (United States)
Rick Foster, Cabot Microelectronics Corp. (United States)
Sumit Guha, Intel Corp. (United States)
Younsoo Ra, KLA-Tencor Corp. (United States)
Hawk Kim, KLA-Tencor Corp. (South Korea)
Anantha Sethuraman, KLA-Tencor Corp. (United States)

Published in SPIE Proceedings Vol. 4275:
Metrology-based Control for Micro-Manufacturing
Kenneth W. Tobin; Fred Lakhani, Editor(s)

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