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Proceedings Paper

SEM defect review and classification for semiconductor device manufacturing
Author(s): Zamir Abraham
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Paper Abstract

Manufacturing of semiconductor devices is an extremely complicated, time consuming, multi-stage process. In order to maintain acceptable yield levels, the production line must be continuously monitored. Scanning Electron Microscopes (SEMs) are employed by all advanced wafer fabrication lines (fabs) for imaging and review of sub- micron defects which may result in faulty circuits. Designed to greatly enhance the functions of a defect review SEM, the Applied Materials SEMVision cXTM is a fully automated defect review and classification system, that is able to generate a novel type of defect image, and to use the information in these images for automatic defect classification. A unique technology that was developed for this purpose is Multiple Perspective SEM Imaging (MPSITM), an electron detection method in which multiple detectors that differ in their spectral and spatial response, are employed such that multiple images (perspectives) containing complementary information are generated simultaneously.

Paper Details

Date Published: 5 June 2001
PDF: 8 pages
Proc. SPIE 4275, Metrology-based Control for Micro-Manufacturing, (5 June 2001); doi: 10.1117/12.429352
Show Author Affiliations
Zamir Abraham, Applied Materials Ltd. (Israel)

Published in SPIE Proceedings Vol. 4275:
Metrology-based Control for Micro-Manufacturing
Kenneth W. Tobin; Fred Lakhani, Editor(s)

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