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Proceedings Paper

High-bandwidth low-power parallel optical interconnect using imaging fiber bundles and standard CMOS detectors
Author(s): Cathleen Rooman; Paul L. Heremans; David Filkins; Reiner Windisch; Gustaaf Borghs; Roger A. Vounckx; Maarten Kuijk
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Paper Abstract

We present a high-bandwidth parallel optical link that operates from CMOS chip to CMOS chip, for applications like chip-to-chip, board-to-board and rack-to-rack interconnects. The optical channel is an oversampling imaging fiber bundle of 1.9 mm diameter. The light sources are a 10 X 10 2D array of high-speed, high-efficiency light-emitting diodes, design for flip-chip mounting onto CMOS driver circuits. Detectors and receivers are integrated together in standard CMOS, as an array of 10 X 10 detector/receiver cells.

Paper Details

Date Published: 30 May 2001
PDF: 6 pages
Proc. SPIE 4292, Optoelectronic Interconnects VIII, (30 May 2001); doi: 10.1117/12.428021
Show Author Affiliations
Cathleen Rooman, IMEC and Univ. of Brussels (Belgium)
Paul L. Heremans, IMEC (Belgium)
David Filkins, Schott Fiber Optics, Inc. (United States)
Reiner Windisch, IMEC (Germany)
Gustaaf Borghs, IMEC (Belgium)
Roger A. Vounckx, Univ. of Brussels (Belgium)
Maarten Kuijk, Univ. of Brussels (Belgium)


Published in SPIE Proceedings Vol. 4292:
Optoelectronic Interconnects VIII
Suning Tang; Yao Li, Editor(s)

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