Share Email Print
cover

Proceedings Paper

Free-space optical interconnection of 3D optoelectronic VLSI chip stacks
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Large-scale computer and data-communication systems have reached a bottleneck in performance in recent years due to the limitations of electronic interconnections for data transfer. One potential solution is based on the use of optoelectronic device arrays for free space optical interconnects. In this paper, we present the design and implementation of a 16 X 16 3D distributed optoelectronic crossbar switch.

Paper Details

Date Published: 30 May 2001
PDF: 10 pages
Proc. SPIE 4292, Optoelectronic Interconnects VIII, (30 May 2001); doi: 10.1117/12.428019
Show Author Affiliations
Dawei Huang, Univ. of California/San Diego (United States)
Emel Yuceturk, Univ. of California/San Diego (United States)
Guoqiang Li, Univ. of California/San Diego (United States)
Mark M. Wang, Univ. of California/San Diego (United States)
Xuezhe Zheng, Univ. of California/San Diego (United States)
Philippe J. Marchand, Univ. of California/San Diego (United States)
Sadik C. Esener, Univ. of California/San Diego (United States)
Yue Liu, Honeywell Inc. (United States)
Volkan H. Ozguz, Irvine Sensors Corp. (United States)


Published in SPIE Proceedings Vol. 4292:
Optoelectronic Interconnects VIII
Suning Tang; Yao Li, Editor(s)

© SPIE. Terms of Use
Back to Top