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Proceedings Paper

Optical interconnects using fiber image guides
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Paper Abstract

We present a novel design for optoelectronic-multi-chip- modules based small segments of rigid imaging fiber bundles. These packages have very small (chip-scale) geometries and support bandwidth and latency comparable to on-chip interconnections.

Paper Details

Date Published: 30 May 2001
PDF: 4 pages
Proc. SPIE 4292, Optoelectronic Interconnects VIII, (30 May 2001); doi: 10.1117/12.428017
Show Author Affiliations
Donald M. Chiarulli, Univ. of Pittsburgh (United States)
Steven Peter Levitan, Univ. of Pittsburgh (United States)


Published in SPIE Proceedings Vol. 4292:
Optoelectronic Interconnects VIII
Suning Tang; Yao Li, Editor(s)

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