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Proceedings Paper

Hybrid integration of light-emitters and detectors with SOI-based micro-opto-electro-mechanical systems (MOEMS)
Author(s): Joel A. Kubby; Jim Calamita; Jen-Tsorng Chang; Jingkuang Chen; Peter Gulvin; C.-C. Lin; Robert Lofthus; Bill Nowak; Yi Su; Alex Tran; David Burns; Janusz Bryzek; John Gilbert; Charles Hsu; Tom Korsmeyer; Arthur S. Morris; Thomas E. Plowman; Vladimir L. Rabinovich; Troy D. Daiber; Bruce R. Scharf; Andrew J. Zosel; Li Fan; Jim Hartman; Anis Husain; Nena Golubovic-Laikopoulos; Raji Mali; Tom Pumo; Steve Delvecchio; Shifang Zhou; Michel Rosa; Decai Sun
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Paper Abstract

A multidisciplinary team of end users and suppliers has collaborated to develop a novel yet broadly enabling process for the design, fabrication and assembly of Micro-Opto- Electro-Mechanical Systems (MOEMS). A key goal is to overcome the shortcomings of the polysilicon layer used for fabricating optical components in a conventional surface micromachining process. These shortcomings include the controllability and uniformity of material stress that is a major cause of curvature and deformation in released microstructures. The approach taken by the consortium to overcome this issue is to use the single-crystal-silicon (SCS) device layer of a silicon-on-insulator (SOI) wafer for the primary structural layer. Since optical flatness and mechanical reliability are of utmost importance in the realization of such devices, the use of the silicon device layer is seen as an excellent choice for devices which rely on the optical integrity of the materials used in their construction. A three-layer polysilicon process consisting of two structural layers is integrated on top of the silicon device layer. This add-on process allows for the formation of sliders, hinges, torsional springs, comb drives and other actuating mechanisms for positioning and movement of the optical components. Flip-chip bonding techniques are also being developed for the hybrid integration of edge and surface emitting lasers on the front and back surfaces of the silicon wafer, adding to the functionality and broadly enabling nature of this process. In addition to process development, the MOEMS manufacturing Consortium is extending Micro-Electro-Mechanical Systems (MEMS) modeling and simulation design tools into the optical domain, and using the newly developed infrastructure for fabrication of prototype micro-optical systems in the areas of industrial automation, optical switching for telecommunications and laser printing.

Paper Details

Date Published: 18 May 2001
PDF: 14 pages
Proc. SPIE 4293, Silicon-based and Hybrid Optoelectronics III, (18 May 2001); doi: 10.1117/12.426941
Show Author Affiliations
Joel A. Kubby, NIST/ATP MOEMS Manufacturing Consortium (United States)
Jim Calamita, Xerox Corp. (United States)
Jen-Tsorng Chang, Xerox Corp. (United States)
Jingkuang Chen, Xerox Corp. (United States)
Peter Gulvin, Xerox Corp. (United States)
C.-C. Lin, Xerox Corp. (United States)
Robert Lofthus, Xerox Corp. (United States)
Bill Nowak, Xerox Corp. (United States)
Yi Su, Xerox Corp. (United States)
Alex Tran, Xerox Corp. (United States)
David Burns, Maxim Integrated Products (United States)
Janusz Bryzek, Maxim Integrated Products (United States)
John Gilbert, Microcosm Technologies (United States)
Charles Hsu, Microcosm Technologies (United States)
Tom Korsmeyer, Microcosm Technologies (United States)
Arthur S. Morris, Microcosm Technologies (United States)
Thomas E. Plowman, Microcosm Technologies (United States)
Vladimir L. Rabinovich, Microcosm Technologies (United States)
Troy D. Daiber, Microscan Systems, Inc. (United States)
Bruce R. Scharf, Microscan Systems, Inc. (United States)
Andrew J. Zosel, Microscan Systems, Inc. (United States)
Li Fan, Optical Micro-Machines, Inc. (United States)
Jim Hartman, Optical Micro-Machines, Inc. (United States)
Anis Husain, Optical Micro-Machines, Inc. (United States)
Nena Golubovic-Laikopoulos, Standard MEMS, Inc. (United States)
Raji Mali, Standard MEMS, Inc. (United States)
Tom Pumo, Standard MEMS, Inc. (United States)
Steve Delvecchio, Standard MEMS, Inc. (United States)
Shifang Zhou, Standard MEMS, Inc. (United States)
Michel Rosa, Xerox Palo Alto Research Ctr. (United States)
Decai Sun, Xerox Palo Alto Research Ctr. (United States)

Published in SPIE Proceedings Vol. 4293:
Silicon-based and Hybrid Optoelectronics III
David J. Robbins; John Alfred Trezza; Ghassan E. Jabbour, Editor(s)

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