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Proceedings Paper

Integration possibilities with MOEMS/MEMS devices and packaging technologies using a MEMS simulation tool
Author(s): Mehmet Dokmeci; Gregory A. Kirkos
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Paper Abstract

This paper reports on monolithic integration possibilities between a novel micromachined packaging technology and MEMS/MOEMS devices. A high-density lead connection scheme is tailored to fulfill the needs of emerging high density optoelectromechanical/microelectromechanical devices. The packaging structure employs double polysilicon as device and package fabrication and anodic bonding as the sealing technology. Thermal stresses arising due to sealing temperatures have been investigated for various device dimensions. The advantages of the micromachined lead transfer and packaging scheme has been explored and it is indicated that it can incorporate both surface and also bulk micromachined devices as post or intermediate processing steps.

Paper Details

Date Published: 16 May 2001
PDF: 12 pages
Proc. SPIE 4290, Optoelectronic Integrated Circuits and Packaging V, (16 May 2001); doi: 10.1117/12.426908
Show Author Affiliations
Mehmet Dokmeci, IntelliSense Corp. (United States)
Gregory A. Kirkos, IntelliSense Corp. (United States)

Published in SPIE Proceedings Vol. 4290:
Optoelectronic Integrated Circuits and Packaging V
Randy A. Heyler; James G. Grote; Randy A. Heyler, Editor(s)

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