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Proceedings Paper

Packaging requirements for integrated optics components
Author(s): Gary C. Bjorklund
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Paper Abstract

Low cost, reliable packaging that meets essential performance requirements is key to future wide-spread applications of future of planar waveguide integrated optics components. Currently, such integrated optics components are being fabricated using a wide variety of design parameters and materials that dictate the optimum packaging approach to be used in each case. However, there are certain universal packaging issues that must be addressed to some degree for all types of integrated optics. These are mechanical support, environmental protection, thermal control, electrical connection, and optical connection. Most applications, particularly those in the telecommunications arena, require that the entire package stand up to wide temperature excursions, humidity, and mechanical shock and vibration.

Paper Details

Date Published: 16 May 2001
PDF: 11 pages
Proc. SPIE 4290, Optoelectronic Integrated Circuits and Packaging V, (16 May 2001); doi: 10.1117/12.426906
Show Author Affiliations
Gary C. Bjorklund, Nanovation Technologies, Inc. (United States)

Published in SPIE Proceedings Vol. 4290:
Optoelectronic Integrated Circuits and Packaging V
Randy A. Heyler; James G. Grote; Randy A. Heyler, Editor(s)

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