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Proceedings Paper

Application of microsandblast machining to LiNbO3 wafer surface for broadband modulators
Author(s): Futoshi Yamamoto; Yuji Yamane; Naoki Mitsugi; Masataka Yokosawa; Hirotoshi Nagata
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Paper Abstract

Machining technology for LiNbO3 (LN) wafer surface aiming a mass-production of broadband LN modulators is investigated. Although several manufacturers commercially supply 40G LN modulators, there are many difficulties in mass-production of such broadband LN modulators. For instance, in order to realize sufficiently broadened bandwidth performance, machining of LN wafer surfaces is necessary as demonstrated by ridge-waveguide modulators and devices using very-thin substrates. We focus the study on the machining technology of LN wafers applicable to mass- production based on micro-sandblast techniques. In order to demonstrate effectiveness of the micro-sandblast, 40G LN modulators designed to have a partially thinned substrate along RF-electrodes are experimentally fabricated.

Paper Details

Date Published: 15 May 2001
PDF: 8 pages
Proc. SPIE 4277, Integrated Optics Devices V, (15 May 2001); doi: 10.1117/12.426815
Show Author Affiliations
Futoshi Yamamoto, Sumitomo Osaka Cement Co., Ltd. (Japan)
Yuji Yamane, Sumitomo Osaka Cement Co., Ltd. (Japan)
Naoki Mitsugi, Sumitomo Osaka Cement Co., Ltd. (Japan)
Masataka Yokosawa, Sumitomo Osaka Cement Co., Ltd. (Japan)
Hirotoshi Nagata, Sumitomo Osaka Cement Co., Ltd. (Japan)

Published in SPIE Proceedings Vol. 4277:
Integrated Optics Devices V
Giancarlo C. Righini; Seppo Honkanen, Editor(s)

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