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Proceedings Paper

Simulations-based design for a large-displacement electrostatically actuated microrelay
Author(s): Gooi Boon Chong; Kam See Hoon; Ijaz H. Jafri; Daniel J. Keating
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Paper Abstract

An electrostatically actuated microrelay with large displacement, small actuation voltage and limited plate surface dimensions is designed to meet stringent telecommunication switching requirements. Fabrication feasibility and performance characteristics of the device are evaluated using a commercial CAD for MEMS tool. Simulation results of the device performance including pull-in voltages for different suspension stiffness variations, natural frequencies, stresses and restoring forces are presented.

Paper Details

Date Published: 5 April 2001
PDF: 9 pages
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, (5 April 2001); doi: 10.1117/12.425384
Show Author Affiliations
Gooi Boon Chong, Nanyang Polytechnic (Singapore)
Kam See Hoon, Nanyang Polytechnic (Singapore)
Ijaz H. Jafri, IntelliSense Corp. (United States)
Daniel J. Keating, IntelliSense Corp. (United States)

Published in SPIE Proceedings Vol. 4408:
Design, Test, Integration, and Packaging of MEMS/MOEMS 2001
Bernard Courtois; Jean Michel Karam; Steven Peter Levitan; Karen W. Markus; Andrew A. O. Tay; James A. Walker, Editor(s)

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