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Proceedings Paper

Challenges of packaging MEMS components for the all-optical networks of the future
Author(s): Ronald E. Scotti; Nagesh R. Basavanhally; Yee L. Low; David A. Ramsey; David J. Bishop
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Paper Abstract

Micro-optoelectromechanical systems (MOEMS) having valuable performance, size, and cost attributes offer novel solutions to the design of lightwave network elements. We will discuss the new challenges that realizing these benefits presents to the field of photonic packaging.

Paper Details

Date Published: 5 April 2001
PDF: 9 pages
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, (5 April 2001); doi: 10.1117/12.425362
Show Author Affiliations
Ronald E. Scotti, Lucent Technologies/Bell Labs. (United States)
Nagesh R. Basavanhally, Lucent Technologies/Bell Labs. (United States)
Yee L. Low, Lucent Technologies/Bell Labs. (United States)
David A. Ramsey, Lucent Technologies/Bell Labs. (United States)
David J. Bishop, Lucent Technologies/Bell Labs. (United States)


Published in SPIE Proceedings Vol. 4408:
Design, Test, Integration, and Packaging of MEMS/MOEMS 2001
Bernard Courtois; Jean Michel Karam; Steven Peter Levitan; Karen W. Markus; Andrew A. O. Tay; James A. Walker, Editor(s)

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