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Proceedings Paper

Compact dynamic thermal multiport models of packages for MEMS-package cosimulation
Author(s): Marta Rencz; Vladimir Szekely
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Paper Abstract

Co-simulation of MEMS and their packages is indispensable if the thermal behavior of the MEMS device is critical. For the co-simulation we need a reduced order thermal model of the package in the form of either behavioral or network model form. The paper presents a method for the automated generation of dynamic thermal multi-port models of packages, based on simulation results. The method is general, in will be applicable also for the direct generation of package multi- port network models of thermal transient testers.

Paper Details

Date Published: 5 April 2001
PDF: 9 pages
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, (5 April 2001); doi: 10.1117/12.425360
Show Author Affiliations
Marta Rencz, MicReD Ltd. and Technical Univ. of Budapest (Hungary)
Vladimir Szekely, Technical Univ. of Budapest (Hungary)

Published in SPIE Proceedings Vol. 4408:
Design, Test, Integration, and Packaging of MEMS/MOEMS 2001
Bernard Courtois; Jean Michel Karam; Steven Peter Levitan; Karen W. Markus; Andrew A. O. Tay; James A. Walker, Editor(s)

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