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Proceedings Paper

Finite element analysis to support component level fault modeling for MEMS
Author(s): R. Reichenbach; Richard Rosing; Andrew Richardson; A. Dorey
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Paper Abstract

Component level (nodal) simulations have been proposed to both implement closed loop simulation of complete microsystems to support the migration to shorter design cycles and implement fault models of micro-mechanical components. Within such a simulation environment, library cells in the form of behavioral models, are used for the basic components of microelectromechanical (MEM) transducers, such as beams, plates, comb-drives and membranes. This paper presents both a methodology to generate the model parameters required for the implementation of accurate component level fault models and simulation results from a number of representative defective structures in a MEMS product.

Paper Details

Date Published: 5 April 2001
PDF: 12 pages
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, (5 April 2001); doi: 10.1117/12.425358
Show Author Affiliations
R. Reichenbach, Lancaster Univ. (United Kingdom)
Richard Rosing, Lancaster Univ. (United Kingdom)
Andrew Richardson, Lancaster Univ. (United Kingdom)
A. Dorey, Lancaster Univ. (United Kingdom)

Published in SPIE Proceedings Vol. 4408:
Design, Test, Integration, and Packaging of MEMS/MOEMS 2001
Bernard Courtois; Jean Michel Karam; Steven Peter Levitan; Karen W. Markus; Andrew A. O. Tay; James A. Walker, Editor(s)

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