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Proceedings Paper

Determining the most likely site and mode of thermomechanical failure in multimaterial systems
Author(s): Andrew A. O. Tay; K. H. Lee; W. Zhou; K. M. Lim
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Paper Abstract

A methodology for predicting sites and modes of thermomechanical failure in IC and MEMS packages is developed. Singular stress fields around several stress concentration locations in a typical plastic-encapsulated IC package are calculated using special variable-order singular boundary elements and the singular value decomposition method. The strain energy density distributions around all the stress concentration locations are then obtained from the singular stress fields and compared. The most likely failure site as the temperature of the package is raised is then determined as well as the likely modes of failure, i.e. interfacial delamination or cracking of mold compound.

Paper Details

Date Published: 5 April 2001
PDF: 13 pages
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, (5 April 2001); doi: 10.1117/12.425353
Show Author Affiliations
Andrew A. O. Tay, National Univ. of Singapore (Singapore)
K. H. Lee, National Univ. of Singapore (Singapore)
W. Zhou, National Univ. of Singapore (Singapore)
K. M. Lim, National Univ. of Singapore (Singapore)

Published in SPIE Proceedings Vol. 4408:
Design, Test, Integration, and Packaging of MEMS/MOEMS 2001
Bernard Courtois; Jean Michel Karam; Steven Peter Levitan; Karen W. Markus; Andrew A. O. Tay; James A. Walker, Editor(s)

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