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Proceedings Paper

Low-cost MOEM interconnect modules for Tb/s.cm2 aggregate bandwidth to silicon chips
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Paper Abstract

We report on the design, the fabrication, the characterization and the demonstration of scalable multi-channel free-space interconnection components with the potential for Tb/s.cm2 aggregate bit rate capacity over inter-chip interconnection distances. The demonstrator components are fabricated in a high quality optical plastic, PMMA, using an ion-based rapid prototyping technology that we call deep proton lithography. With the presently achieved Gigabit/s data rates for each of the individual 16 channels with a BER smaller than 10-13 and with inter-channel cross-talk lower than -22dB the module aims at optically interconnecting 2-D opto-electronic VCSEL and receiver arrays, flip-chip mounted on CMOS circuitry. Furthermore, using ray-tracing software and radiometric simulation tools, we perform a sensitivity analysis for misalignment and fabrication errors on these plastic micro-optical modules and we study industrial fabrication and material issues related to the mass- replication of these components through injection-molding techniques. Finally we provide evidence that these components can be mass-fabricated in dedicated, highly-advanced optical plastics at low cost and with the required precision.

Paper Details

Date Published: 5 April 2001
PDF: 13 pages
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, (5 April 2001); doi: 10.1117/12.425348
Show Author Affiliations
Hugo Thienpont, Vrije Univ. Brussel (Belgium)
Valerie Baukens, Vrije Univ. Brussel (Belgium)
Bart Volckaerts, Vrije Univ. Brussel (Belgium)
Heidi Ottevaere, Vrije Univ. Brussel (Belgium)
Christof Debaes, Vrije Univ. Brussel (Belgium)
Michael Vervaeke, Vrije Univ. Brussel (Belgium)
Patrik Tuteleers, Vrije Univ. Brussel (Belgium)
Pedro Vynck, Vrije Univ. Brussel (Belgium)
Alex Hermanne, Vrije Univ. Brussel (Belgium)
Mike Hanney, CTP-COIL (United Kingdom)
Marnik Brunfaut, Univ. Gent (Belgium)
Jan M. Van Campenhout, Univ. Gent (Belgium)
Irina P. Veretennicoff, Vrije Univ. Brussel (Belgium)


Published in SPIE Proceedings Vol. 4408:
Design, Test, Integration, and Packaging of MEMS/MOEMS 2001
Bernard Courtois; Jean Michel Karam; Steven Peter Levitan; Karen W. Markus; Andrew A. O. Tay; James A. Walker, Editor(s)

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