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Proceedings Paper

Ultrahigh capacity MEMS-based optical cross-connects (Abstract Only)
Author(s): Keren Bergman; Nicolas H. Bonadeo; Igal Brener; Kophu P. Chiang
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Paper Abstract

Backbone optical systems with ever-increasing transport capacity and routing complexity are driving the need for large port count core switches that can intelligently scale to manage the amounting bandwidth mass. Optical switching fabrics and in particular those based on MEMS technology potentially offer a scalable solution for the cross-connect network element. However the road from this exciting research endeavor to creating a reliable and manufacturable product is filled with challenges. The design, integration, and assembly of optical switch fabrics with over 1000 working ports stress all aspects of product development from component fabrication to mechanical tolerances and thermal manageability. In this paper we describe the myriad of contending optical, mechanical, and electronic design tradeoffs that contribute to the development of a 3D-MEMS based optical cross-connect.

Paper Details

Date Published: 5 April 2001
PDF: 4 pages
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, (5 April 2001); doi: 10.1117/12.425346
Show Author Affiliations
Keren Bergman, Tellium, Inc. (United States)
Nicolas H. Bonadeo, Tellium, Inc. (United States)
Igal Brener, Tellium, Inc. (United States)
Kophu P. Chiang, Tellium, Inc. (United States)

Published in SPIE Proceedings Vol. 4408:
Design, Test, Integration, and Packaging of MEMS/MOEMS 2001
Bernard Courtois; Jean Michel Karam; Steven Peter Levitan; Karen W. Markus; Andrew A. O. Tay; James A. Walker, Editor(s)

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