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Proceedings Paper

Development of a micromolding process
Author(s): Wayne Nguyen Phu Hung; Shu Yuan; E. C. W. Lee; Mohammad Yeakub Ali
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Paper Abstract

This paper presents the simulating and experimental results of a micromolding process for fabrication of three-dimensional (3D) microcomponents. The maskless process utilizes a micro electrical discharging system for bulk machining, then finish machining using focused-ion beam to sputter the mold microcavity, which is then filled with various types of plastics. Simulation using commercially available software reveals possible problems in micromolding, and the simulation results of microgears ((phi) 100 - 1000 micrometer diameter, 1:1 aspect ratio) are compared with those from actually molded microgears. Although the software prohibits modeling of a stand-alone microgear with diameter below (phi) 1000 micrometer when using a 2.5 D model and (phi) 220 micrometer for a 3D model, the simulation succeeds upon integrating a microgear of (phi) 100 micrometer with a larger base. Selecting the polymers from the built-in data bank, the simulation pinpoints locations for trapped gas, predicts filling time, volumetric shrinkage, uniformity, and distribution of pressure, shear rate, stress... It correctly predicts underfilling of the cavity when the mold temperature is below a threshold, but fails to locate the weld lines. Minimum channel sizes for proper flow of several plastics are presented, and the mold temperature must be controlled for proper flow of polymer into a microcavity. The measured viscosity of tested polymers compliments the experimental and simulating results.

Paper Details

Date Published: 5 April 2001
PDF: 12 pages
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, (5 April 2001); doi: 10.1117/12.425342
Show Author Affiliations
Wayne Nguyen Phu Hung, Nanyang Technological Univ. (United States)
Shu Yuan, Nanyang Technological Univ. (Singapore)
E. C. W. Lee, Nanyang Technological Univ. (Singapore)
Mohammad Yeakub Ali, Nanyang Technological Univ. (Singapore)


Published in SPIE Proceedings Vol. 4408:
Design, Test, Integration, and Packaging of MEMS/MOEMS 2001

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