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Proceedings Paper

Thermal-induced stress in dielectric membranes suitable for micromechanized gas sensors
Author(s): J. Puigcorbe; A. Vila; Isabel Gracia; Carles Cane; Juan Ramon Morante
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Paper Abstract

A laboratory model of a gas sensor substrate produced in microelectronic technology has been experimentally analyzed and simulated by means of a 3D FEM model. This paper discusses its thermal and mechanical behavior under different working temperatures. The thermal expansion mismatch between different materials induces thermal stresses and structure deflection. Simulated and experimental results are proved to be in good agreement. Moreover, the proposed design offers low-power consumption, good thermal uniformity, low thermal inertia and mechanical stability up to 650 degrees Celsius.

Paper Details

Date Published: 5 April 2001
PDF: 5 pages
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, (5 April 2001); doi: 10.1117/12.425339
Show Author Affiliations
J. Puigcorbe, Barcelona Univ. (Spain)
A. Vila, Barcelona Univ. (Spain)
Isabel Gracia, Ctr. Nacional de Microelectroncia (Spain)
Carles Cane, Ctr. Nacional de Microelectroncia (Spain)
Juan Ramon Morante, Barcelona Univ. (Spain)

Published in SPIE Proceedings Vol. 4408:
Design, Test, Integration, and Packaging of MEMS/MOEMS 2001
Bernard Courtois; Jean Michel Karam; Steven Peter Levitan; Karen W. Markus; Andrew A. O. Tay; James A. Walker, Editor(s)

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