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Proceedings Paper

Micro-CT for nondestructive 3D reconstruction of MEMS and sensors
Author(s): Alexander Sasov
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Paper Abstract

The combination of x-ray microscopy with tomographical reconstruction allows getting 3D information about the internal microstructure by a non-destructive way. A desktop high- resolution X-ray micro-CT (microtomograph) has been developed for 3D reconstruction and realistic visualization of the internal microstructure with spatial resolution in the micron range. The instrument was successfully tested for inspection, defectoscopy and back engineering in MEMS and integrated multichip sensors.

Paper Details

Date Published: 30 April 2001
PDF: 7 pages
Proc. SPIE 4407, MEMS Design, Fabrication, Characterization, and Packaging, (30 April 2001); doi: 10.1117/12.425326
Show Author Affiliations
Alexander Sasov, SkyScan (Belgium)


Published in SPIE Proceedings Vol. 4407:
MEMS Design, Fabrication, Characterization, and Packaging

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