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Proceedings Paper

Integrated microsystems in standard CMOS technology with applications in the field of chemical sensors
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Paper Abstract

In this paper some recent results, regarding the research activity currently in progress in the field of MEMS at the DEES, University of Catania, are reported. In particular some microsystem prototypes, realized by using a standard CMOS process (AMS 0.8 micrometers CMOS) through the EuroPractice service, are described. A novel IC has been realized, it contains several different structures designed both for particular applications and for technology characterization purposes. A set of devices has been realized through 'front side bulk micromachining' and some other novel structures where the polysilicon layer is used as sacrificial layer have been investigated. In order to ensure fully compatibility with CMOS electronics, a wet etching process has been performed by using TMAH. Characterizations of the wet etching process are being performed in order to exploit the absence of crystallographic structure in polysilicon to allow for isotropic etching micromachining. Some applications of Microsystems in different fields are also presented.

Paper Details

Date Published: 30 April 2001
PDF: 10 pages
Proc. SPIE 4407, MEMS Design, Fabrication, Characterization, and Packaging, (30 April 2001); doi: 10.1117/12.425320
Show Author Affiliations
Salvatore Baglio, Univ. of Catania (Italy)
Bruno Ando, Univ. of Catania (Italy)
Nicolo Savalli, Univ. of Catania (Italy)


Published in SPIE Proceedings Vol. 4407:
MEMS Design, Fabrication, Characterization, and Packaging
Uwe F. W. Behringer; Deepak G. Uttamchandani, Editor(s)

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