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Proceedings Paper

Modeling and simulation of a silicon microdiaphragm piezoresistive pressure sensor using finite element analysis (FEA) tools
Author(s): A. J. Pang; Marc P.Y. Desmulliez
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Paper Abstract

In this paper, diaphragm deflection and output voltage obtained by applying a series of pressure loads to a silicon piezoresistive micro-diaphragm with built-in edges are presented. A silicon pressure sensor with diaphragm of 1 mm in length and 10 mm in thickness is modelled. Finite Element Analysis results are compare with other experimental and numerical results. A series of simulation on sensor with diaphragm of 3.4-mm in length and various thicknesses, meshing densities and resistor lengths is performed. Discussion of results are based upon (1) effect of different resistor lengths on output voltage and sensitivity and (2) effect of different diaphragm thicknesses on output are presented.

Paper Details

Date Published: 30 April 2001
PDF: 10 pages
Proc. SPIE 4407, MEMS Design, Fabrication, Characterization, and Packaging, (30 April 2001); doi: 10.1117/12.425318
Show Author Affiliations
A. J. Pang, Heriot-Watt Univ. (United Kingdom)
Marc P.Y. Desmulliez, Heriot-Watt Univ. (United Kingdom)

Published in SPIE Proceedings Vol. 4407:
MEMS Design, Fabrication, Characterization, and Packaging
Uwe F. W. Behringer; Deepak G. Uttamchandani, Editor(s)

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