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Proceedings Paper

Silicon MEM technology for millimeter-wave applications
Author(s): Katia M. Grenier; D. Dubuc; Patrick Pons; Robert Plana; L. Rabbia; T. Parra; Jacques Graffeuil
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Paper Abstract

This paper presents a new silicon technology that is used for innovative components such as a MicroElectroMechanical Systems for microwave and millimeter-wave applications. This technology is based on two different bulk and surface silicon micro- machining processes. The former one, the bulk micro-machining, is well fitted to the realization of low loss microwave circuits suspended on a thin membrane, whereas the surface one allows the realization of actuable devices. This confers to the structure an interesting MEM behavior particularly important in millimeter- wave applications. As a demonstration of the advantage of combining surface and bulk micromachining a low loss (< 0.1 dB at 100 GHz), high isolation (approximately equals 30 dB at 10 GHz) capacitive switch has been designed, processed and measured. A distributed switch with enhanced performance has also been investigated.

Paper Details

Date Published: 30 April 2001
PDF: 11 pages
Proc. SPIE 4407, MEMS Design, Fabrication, Characterization, and Packaging, (30 April 2001); doi: 10.1117/12.425307
Show Author Affiliations
Katia M. Grenier, LAAS/CNRS and Univ. Paul Sabatier (France)
D. Dubuc, LAAS/CNRS and Univ. Paul Sabatier (France)
Patrick Pons, LAAS/CNRS (France)
Robert Plana, LAAS/CNRS and Univ. Paul Sabatier (France)
L. Rabbia, LAAS/CNRS (France)
T. Parra, LAAS/CNRS and Univ. Paul Sabatier (France)
Jacques Graffeuil, LAAS/CNRS and Univ. Paul Sabatier (France)


Published in SPIE Proceedings Vol. 4407:
MEMS Design, Fabrication, Characterization, and Packaging
Uwe F. W. Behringer; Deepak G. Uttamchandani, Editor(s)

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