Share Email Print
cover

Proceedings Paper

MEMS hybridization: bridging the free-space gap
Author(s): Paul Blair; Duncan McMillan; Jean Podlecki; Mark L. Begbie; Kevin Yallup
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

The increasing demand for bandwidth is driving the development of new paradigms within the fibre optic telecomms industry and leading to the generation of a new range of optical components. One route being taken is the hybridization of discrete components into a single package to realize high functionality subsystems. The combination of MEMS with light guide technology is one hybridization pathway that is showing considerable potential. In the drive for novel functionality it is paramount that the performance parameters are not compromised, nor should the hybridization of discrete components lead to increased manufacturing and packaging complexity and reliability issues. A theoretical and experimental study of integration schemes has shown that it is possible to integrate MEMS components with light guide technologies using just simple air gaps while preserving key performance parameters.

Paper Details

Date Published: 30 April 2001
PDF: 9 pages
Proc. SPIE 4407, MEMS Design, Fabrication, Characterization, and Packaging, (30 April 2001); doi: 10.1117/12.425302
Show Author Affiliations
Paul Blair, Kymata Ltd. (United Kingdom)
Duncan McMillan, Kymata Ltd. (United Kingdom)
Jean Podlecki, Kymata Ltd. (United Kingdom)
Mark L. Begbie, Kymata Ltd. (United Kingdom)
Kevin Yallup, Kymata Ltd. (United Kingdom)


Published in SPIE Proceedings Vol. 4407:
MEMS Design, Fabrication, Characterization, and Packaging

© SPIE. Terms of Use
Back to Top