Share Email Print
cover

Proceedings Paper

3D-CSP: an innovative packaging method based on RMPD
Author(s): Helge Bohlmann; Reiner Goetzen; Andrea Reinhardt
Format Member Price Non-Member Price
PDF $17.00 $21.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

A major bottleneck in the applications of microtechnologies are packaging and interconnection techniques. 3D-CSP (3D-Chip-Size- Packaging), which is based on RMPDTM, solves an extremely wide range of packaging problems. RMPDTM and 3D-CSP are discussed and applications presented.

Paper Details

Date Published: 30 April 2001
PDF: 5 pages
Proc. SPIE 4407, MEMS Design, Fabrication, Characterization, and Packaging, (30 April 2001); doi: 10.1117/12.425300
Show Author Affiliations
Helge Bohlmann, microTEC Gesselschaft fuer Mikrotechnologie GmbH (Germany)
Reiner Goetzen, microTEC Gesselschaft fuer MikrotechnologieGmbH (Germany)
Andrea Reinhardt, microTEC Gesselschaft fuer Mikrotechnologie GmbH (Germany)


Published in SPIE Proceedings Vol. 4407:
MEMS Design, Fabrication, Characterization, and Packaging
Uwe F. W. Behringer; Deepak G. Uttamchandani, Editor(s)

© SPIE. Terms of Use
Back to Top