Share Email Print
cover

Proceedings Paper

Fabrication of silicon sidewall profiles for fluidic applications using modified advanced silicon etching
Author(s): Chi-fu Wu; Lars Erdmann; Kaigham J. Gabriel; S. C. Yao
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

In this work, we present a new deep etching sequence for the fabrication of circular cavities in straight silicon sidewalls. This approach allows alternating anisotropic/isotropic etches without affecting the profile generated in prior etching steps. This process sequence is crucial for realizing silicon structures that enable a variety of new applications, such as turbulence promoted liquid injector to disperse liquid effectively at the minimum injection pressure for electronic cooling, micro-evaporator or micro-combustors, surface enhancement (increase boiling nucleate sites) for micro-channel heat transfer, fluid mixing enhancer, isolation of electronic microstructures and release of mechanical microstructures.

Paper Details

Date Published: 30 April 2001
PDF: 9 pages
Proc. SPIE 4407, MEMS Design, Fabrication, Characterization, and Packaging, (30 April 2001); doi: 10.1117/12.425289
Show Author Affiliations
Chi-fu Wu, Carnegie Mellon Univ. (United States)
Lars Erdmann, Carnegie Mellon Univ. (Germany)
Kaigham J. Gabriel, Carnegie Mellon Univ. (United States)
S. C. Yao, Carnegie Mellon Univ. (United States)


Published in SPIE Proceedings Vol. 4407:
MEMS Design, Fabrication, Characterization, and Packaging
Uwe F. W. Behringer; Deepak G. Uttamchandani, Editor(s)

© SPIE. Terms of Use
Back to Top