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Proceedings Paper

Failure analysis of advanced packaging technologies using scanning acoustic microscopy
Author(s): John J. Barton; Anthony Compagno; Cian O'Mathuna
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Paper Abstract

In recent years, scanning acoustic microscopy (SAM) has been found to be a very successful technique when used in the microelectronics industry to evaluate, from a reliability perspective, standard plastic packaging technologies such as PQFP's, PLCC's, DIP's and SOP's. The recent explosion of advanced packaging techniques such as Chip-on-Board, Flip-chip and BGA and the proliferation of Microsystems has further widened the arena of what constitutes microelectronics. With such a wide breadth of devices from standard plastic packages to state-of-the-art microsystems, it is difficult to find a failure analysis technique which can cope competently with that scope. SAM is one such technique. This paper will demonstrate the effectiveness of SAM at non-destructively analyzing a range of advanced packaging technologies from integrated passive to flip-chip to microsystems.

Paper Details

Date Published: 23 April 2001
PDF: 10 pages
Proc. SPIE 4406, In-Line Characterization, Yield, Reliability, and Failure Analysis in Microelectronic Manufacturing II, (23 April 2001); doi: 10.1117/12.425281
Show Author Affiliations
John J. Barton, National Microelectronics Research Ctr. (Ireland)
Anthony Compagno, National Microelectronics Research Ctr. (Ireland)
Cian O'Mathuna, National Microelectronics Research Ctr. (Ireland)


Published in SPIE Proceedings Vol. 4406:
In-Line Characterization, Yield, Reliability, and Failure Analysis in Microelectronic Manufacturing II
Gudrun Kissinger; Larg H. Weiland, Editor(s)

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