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Proceedings Paper

Integrated metrology: an enabler for advanced process control (APC)
Author(s): Claus Schneider; Lothar Pfitzner; Heiner Ryssel
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Paper Abstract

Advanced process control (APC) techniques become more and more important as short innovation cycles in microelectronics and a highly competitive market requires cost-effective solutions in semiconductor manufacturing. APC marks a paradigm shift from statistically based techniques (SPC) using monitor wafers for sampling measurement data towards product wafer control. The APC functionalities including run-to-run control, fault detection, and fault analysis allow to detect process drifts and excursions at an early stage and to minimize the number of misprocessed wafers. APC is being established as part of factory control systems through the definition of an APC framework. A precondition for APC is the availability of sensors and measurement methods providing the necessary wafer data. This paper discusses integrated metrology as an enabler for APC and demonstrates practical implementations in semiconductor manufacturing.

Paper Details

Date Published: 23 April 2001
PDF: 13 pages
Proc. SPIE 4406, In-Line Characterization, Yield, Reliability, and Failure Analysis in Microelectronic Manufacturing II, (23 April 2001); doi: 10.1117/12.425280
Show Author Affiliations
Claus Schneider, Fraunhofer Institute for Integrated Circuits (Germany)
Lothar Pfitzner, Fraunhofer Institute for Integrated Circuits (Germany)
Heiner Ryssel, Fraunhofer Institute for Integrated Circuits (Germany)


Published in SPIE Proceedings Vol. 4406:
In-Line Characterization, Yield, Reliability, and Failure Analysis in Microelectronic Manufacturing II
Gudrun Kissinger; Larg H. Weiland, Editor(s)

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