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Proceedings Paper

In-line failure analysis on productive wafers with dual-beam SEM/FIB systems
Author(s): Rainer Weiland; Christian Boit; Nick Dawes; Andreas Dziesiaty; Ernst Demm; Bernd Ebersberger; Lothar Frey; Stefan Geyer; Alexander Hirsch; Christoph Lehrer; Peter Meis; Matthias Kamolz; Henri Lezec; Hans Rettenmaier; Wolfgang Tittes; Rolf Treichler; Harald Zimmermann
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Paper Abstract

Modern dual beam SEM/FIB tools will allow physical failure analysis on productive wafers in the cleanroom if contamination of wafer and production equipment can be controlled. In this study we show that the risks of Ga- diffusion and -desorption as well as heavy metal contamination can be overcome. The reentry of analyzed wafers into the production flow results in lower overall costs and a dramatically shortened feedback loop to production engineers, leading to reduced down times of production tools etc. Most FIB-applications (i.e. highlight etch of cross sections) can be processed with appropriate gas chemistry. Ion Beam deposition of an insulating material to refill the crater created by the sputtering process is also investigated. If either resolution is not sufficient or more complex analyses have to be applied a sample lift-out technique was developed making it obsolete to sacrifice wafers also in these cases. The fixed sample can be analyzed off-line with all PFA- methods, even plasma etching or lift-off in HF is possible. The benefits of this quantum leap for physical failure analysis are reduction of wafer costs and the possibility to reduce analysis cycle time as well as the number of learning cycles in technology development.

Paper Details

Date Published: 23 April 2001
PDF: 10 pages
Proc. SPIE 4406, In-Line Characterization, Yield, Reliability, and Failure Analysis in Microelectronic Manufacturing II, (23 April 2001); doi: 10.1117/12.425274
Show Author Affiliations
Rainer Weiland, Infineon Technologies AG (Germany)
Christian Boit, Infineon Technologies AG (Germany)
Nick Dawes, FEI Co. (United States)
Andreas Dziesiaty, FEI Co. (Germany)
Ernst Demm, Infineon Technologies Corp. (United States)
Bernd Ebersberger, Infineon Technologies AG (Germany)
Lothar Frey, Fraunhofer-Gesellschaft (Germany)
Stefan Geyer, Infineon Dresden GmbH & Co. KG (Germany)
Alexander Hirsch, Infineon Technologies Corp. (United States)
Christoph Lehrer, Fraunhofer-Gesellschaft (Germany)
Peter Meis, Infineon Technologies AG (Germany)
Matthias Kamolz, Infineon Dresden GmbH & Co. KG (Germany)
Henri Lezec, Univ. Louis Pasteur (France)
Hans Rettenmaier, Infineon Dresden GmbH & Co. KG (Germany)
Wolfgang Tittes, Infineon Dresden GmbH & Co. KG (Germany)
Rolf Treichler, Siemens AG (Germany)
Harald Zimmermann, Silicon Valley Group, Inc. (Germany)


Published in SPIE Proceedings Vol. 4406:
In-Line Characterization, Yield, Reliability, and Failure Analysis in Microelectronic Manufacturing II

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