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Proceedings Paper

Adapted time power profile for laser beam soldering with solder paste
Author(s): Luedger Bosse; Arnold Gillner; Reinhart Poprawe
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Paper Abstract

Today laser beam soldering (LBS) is a non-standard manufacturing process for electronic packaging and interconnection technology. However due to the onwardly going miniaturization and the world-wide trend towards lead-free solders LBS gains more attention for certain applications in this field. In mass-production, e.g. in interconnection technology of electronic devices, it is state-of-the-art to use solder alloys in the form of paste. Today it is a well- known process to handle or to deposit solder paste. Furthermore the composition of solder systems, consisting of metal alloys and fluxes, can be optimized for individual products and production conditions. Yet this optimization process is only in part performed for LBS with solder paste. Therefore the application of standard reflow solder pastes for LBS poses problems like gas eruptions, solder balling and overheating. In order to overcome these quality problems an adapted time-power-profile for LBS with solder paste has been developed, using synchronized high-speed photography and detection of secondary emissions from the joining area. The evaluation of the experiments allows the generation of high quality solder joints with standard diode laser systems and solder pastes. In addition it is possible to realize an online-process control via detecting the secondary emissions from the subsequent transformation stages of the solder paste. Conclusively it can be said LBS is a stable, reproducible process for applications requiring a controlled locally limited heat input and reduced thermal and mechanical stress compared to conventional techniques.

Paper Details

Date Published: 23 April 2001
PDF: 6 pages
Proc. SPIE 4406, In-Line Characterization, Yield, Reliability, and Failure Analysis in Microelectronic Manufacturing II, (23 April 2001); doi: 10.1117/12.425260
Show Author Affiliations
Luedger Bosse, Fraunhofer-Institut fuer Lasertechnik (Germany)
Arnold Gillner, Fraunhofer-Institut fuer Lasertechnik (Germany)
Reinhart Poprawe, Fraunhofer-Institut fuer Lasertechnik (Germany)


Published in SPIE Proceedings Vol. 4406:
In-Line Characterization, Yield, Reliability, and Failure Analysis in Microelectronic Manufacturing II

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