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Proceedings Paper

Use of control rules and stability index to maintain an effective SPC system in a high-volume fab
Author(s): Laurie McTurk
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Paper Abstract

In semiconductor manufacturing there is a requirement to control the production processes in order to safeguard the final product electrical performance and wafer yield. As technology increases the number of photo and metal layers increase and the number of production processes to control increases proportionately. It is very important that engineers have the appropriate level of SPC in place at each process such that an alarm is raised and production stopped if a real process excursion takes place. Over control, on the other hand, can actually induce variation or lead to a situation where processes are often stopped due to false alarms. Too little or too much control is unacceptable and either could lead to failure due to yield busts or high production costs. This paper describes how a robust SPC model can be installed and, just as importantly, maintained, in an environment where few engineers are required to manage thousands of process control charts.

Paper Details

Date Published: 20 April 2001
PDF: 9 pages
Proc. SPIE 4405, Process and Equipment Control in Microelectronic Manufacturing II, (20 April 2001); doi: 10.1117/12.425237
Show Author Affiliations
Laurie McTurk, Motorola (United States)


Published in SPIE Proceedings Vol. 4405:
Process and Equipment Control in Microelectronic Manufacturing II
Martin Fallon, Editor(s)

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