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Proceedings Paper

Photolithography on micromachined 3D surfaces using spray coating technology of photoresist
Author(s): Arief Suriadi; Thomas Luxbacher
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Paper Abstract

A relatively little known form of photoresist coating for special applications of 3D structured wafer patterning by spray technology has been studied, specifically on the OnmiSpray coating technology developed by Electronics Vision Group Austria. Results of the present investigation confirm the superior uniformity of photoresist coating by spray technology on the high topography wafer structure compared to the conventional spin coating method, typically used on planar semiconductor wafer structure. Special attention is paid to the improvement of photoresist coverage on the convex corners of the 3D structure by rounding them off first in a TMAH solution. The integrated method offers an enabling technology for patterning of extensive topography typically required for a multitude of MEMS structures and designs, novel interconnect structures as well as advanced packaging applications. The method is simple, fast and low cost in comparison with other photoresist coating techniques available and capable of 3D structure patterning.

Paper Details

Date Published: 26 April 2001
PDF: 9 pages
Proc. SPIE 4404, Lithography for Semiconductor Manufacturing II, (26 April 2001); doi: 10.1117/12.425213
Show Author Affiliations
Arief Suriadi, Hewlett-Packard Co. (Singapore)
Thomas Luxbacher, EV Group E. Thallner GmbH (Austria)

Published in SPIE Proceedings Vol. 4404:
Lithography for Semiconductor Manufacturing II
Chris A. Mack; Tom Stevenson, Editor(s)

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