Share Email Print
cover

Proceedings Paper

MEEF management and the effect of assist feature optical proximity corrections
Author(s): Michael T. Reilly; Colin R. Parker; Stewart A. Robertson
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

DUV lithography for 130 nm features requires several resolution enhancement techniques for a robust manufacturing process. These include modified illumination, optical proximity correction and, eventually, phase shift masks. Illumination and mask enhancements improve aerial image quality and serve to maintain that improvement over a suitably larger range of defocus than would otherwise be obtained. The former technique expands process margins most effectively for only the semi-dense through dense pitches of lines and spaces. The more isolated features are unaffected by this approach, so common process latitude is reduced since the overlap of the individual windows is driven apart by the difference of sizing energies of the features. Scattering bars, which are sub-resolution assist features used in OPC for the more isolated features, offset this effect by inducing a diffraction pattern that is more similar to dense lines. The result is enhanced focus latitude for the individual feature and improved common latitude through increased overlap of process windows.

Paper Details

Date Published: 26 April 2001
PDF: 8 pages
Proc. SPIE 4404, Lithography for Semiconductor Manufacturing II, (26 April 2001); doi: 10.1117/12.425205
Show Author Affiliations
Michael T. Reilly, Shipley Co. Inc. (United States)
Colin R. Parker, Shipley Co. Inc. (United States)
Stewart A. Robertson, Shipley Co. Inc. (United States)


Published in SPIE Proceedings Vol. 4404:
Lithography for Semiconductor Manufacturing II

© SPIE. Terms of Use
Back to Top