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Proceedings Paper

Progress in placement control for ion beam stencil mask technology
Author(s): Frank-Michael Kamm; Albrecht Ehrmann; Thomas Struck; Karl Kragler; Joerg Butschke; Florian Letzkus; Reinhard Springer; Ernst Haugeneder; Artur Degen; Jens Voigt; Martin Kratzenberg; Ivo W. Rangelow
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Paper Abstract

A short review of the current status of IPL stencil mask development is presented in this paper. Stencil masks based on 6' Si-wafer have been fabricated with a membrane diameter of 126 mm. With a typical membrane thickness of 3 micrometers , mechanical stability is a critical issue. The resulting placement errors have been measured using an LMS IPRO measurement tool and have been compared to Finite Element (FE) calculations simulating the fabrication process. Process-induced distortions can be predicted by FE calculations with an accuracy of up to 24 mm 3(sigma) . In addition to large circular membranes, an alternative geometry has been considered. Masks with a quadratic membrane area of 60 X 60 mm2 show IPDs of 3(sigma) equals 39 nm which are about 4 times smaller than those of large circular membranes. This result agrees well with predictions of FE calculations. In order to protect the Si-mask against ion bombardment, a protective carbon layer is deposited onto the membrane, thus preventing stress changes due to ion implantation. The current status of the carbon deposition process will also be addressed briefly.

Paper Details

Date Published: 9 April 2001
PDF: 5 pages
Proc. SPIE 4349, 17th European Conference on Mask Technology for Integrated Circuits and Microcomponents, (9 April 2001); doi: 10.1117/12.425098
Show Author Affiliations
Frank-Michael Kamm, Infineon Technologies AG (Germany)
Albrecht Ehrmann, Infineon Technologies AG (Germany)
Thomas Struck, Infineon Technologies AG (Germany)
Karl Kragler, Infineon Technologies AG (Germany)
Joerg Butschke, Institut fuer Mikroelektroniks (Germany)
Florian Letzkus, Institut fuer Mikroelektroniks (Germany)
Reinhard Springer, Institut fuer Mikroelektroniks (Germany)
Ernst Haugeneder, Ionen Mikrofabrikations Systeme GmbH (Austria)
Artur Degen, Univ. of Kassel (Germany)
Jens Voigt, Univ. of Kassel (Germany)
Martin Kratzenberg, Univ. of Kassel (Germany)
Ivo W. Rangelow, Univ. of Kassel (Germany)

Published in SPIE Proceedings Vol. 4349:
17th European Conference on Mask Technology for Integrated Circuits and Microcomponents
Uwe F. W. Behringer, Editor(s)

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