Share Email Print
cover

Proceedings Paper

Strategies for wafer-scale hot embossing lithography
Author(s): Hella-Christin Scheer; Hubert Schulz; D. Lyebyedyev
Format Member Price Non-Member Price
PDF $17.00 $21.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

We summarize flow and filling effects detected during hot embossing lithography (HEL), which reflect the visco-elastic properties of the polymers as well as the specific processing conditions and stamp pattern configurations. In particular a delayed elastic recovery is reported, which is found in larger elevated stamp regions. The consequences of these effects for mask definition by HEL are discussed, and strategies for wafer-scale imprint are de-duced. Successful imprint of 4' wafer is demonstrated under adequate processing conditions.

Paper Details

Date Published: 9 April 2001
PDF: 4 pages
Proc. SPIE 4349, 17th European Conference on Mask Technology for Integrated Circuits and Microcomponents, (9 April 2001); doi: 10.1117/12.425080
Show Author Affiliations
Hella-Christin Scheer, Univ. of Wuppertal (Germany)
Hubert Schulz, Univ. of Wuppertal (Germany)
D. Lyebyedyev, Univ. of Wuppertal (Germany)


Published in SPIE Proceedings Vol. 4349:
17th European Conference on Mask Technology for Integrated Circuits and Microcomponents
Uwe F. W. Behringer, Editor(s)

© SPIE. Terms of Use
Back to Top