Share Email Print
cover

Proceedings Paper

Polysilicon TFT on plastics
Author(s): Tatsuya Shimoda; Satoshi Inoue; Sumio Utsunomiya
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

A novel technology that makes it possible to transfer thin film devices from an original substrate to the other one by using laser ablation/annealing has been developed. This technology is named SUFTLA which stands for surface free technology by laser ablation/annealing. In the process of this technology, polycrystalline-silicon thin film transistors and TAFT circuits, which are firstly fabricated by the low-temperature process below 425 degrees C on quartz or glass substrates, are transferred onto plastic substrates. Any degradation during the transfer process are not observed. By using this technology, CMOS ring oscillators and a TAFT array with integrated drivers for LCD have been developed on plastic substrates and their compete operations were confirmed. This technology is not only applied for displays such as LCD and OELD, but also to any kinds of TAFT circuits including memories and logics on plastics. It also enable us to fabricate a 3D ICs with a very simple manner.

Paper Details

Date Published: 30 April 2001
PDF: 8 pages
Proc. SPIE 4295, Flat Panel Display Technology and Display Metrology II, (30 April 2001); doi: 10.1117/12.424888
Show Author Affiliations
Tatsuya Shimoda, Seiko Epson Corp. (Japan)
Satoshi Inoue, Seiko Epson Corp. (Japan)
Sumio Utsunomiya, Seiko Epson Corp. (Japan)


Published in SPIE Proceedings Vol. 4295:
Flat Panel Display Technology and Display Metrology II
Edward F. Kelley; Edward F. Kelley; Apostolos T. Voutsas, Editor(s)

© SPIE. Terms of Use
Back to Top