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Proceedings Paper

Simulation of novel microassembly using shape memory alloy
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Paper Abstract

In this paper, a novel micro assembly method using Shape Memory Alloy (SMA) is investigated. The principle of this method and its advantages are briefly discussed. A finite element package, ANSYS, is used to simulate the whole assembly process. A special material element is used for modeling the behavior of SMA.

Paper Details

Date Published: 21 March 2001
PDF: 9 pages
Proc. SPIE 4235, Smart Structures and Devices, (21 March 2001); doi: 10.1117/12.420848
Show Author Affiliations
Weiming Huang, Nanyang Technological Univ. (Singapore)
Xiangyang Gao, Nanyang Technological Univ. (Singapore)


Published in SPIE Proceedings Vol. 4235:
Smart Structures and Devices
Dinesh K. Sood; Ronald Albert Lawes; Vasundara V. Varadan, Editor(s)

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