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Proceedings Paper

Electroplated microneedle array for biomedical applications
Author(s): Kuo Kang Liu; Z. H. Du; F. G. Tseng; Min-Chieh Chou; J. Y. Fang; C. C. Chieng
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Paper Abstract

NiICo microneedle arrays, which are fabricated by conventional near UV lithography and chemical electroplating process on a silicon wafer, are reported here. These metallic microneedles with annular structure could be easily incorporated with micropump for drug delivery and in-situ physiological fluid sampling. The mechanical strength inherent in the alloy provides excellent durability for the needles to sustain in process and clinic test.

Paper Details

Date Published: 16 March 2001
PDF: 5 pages
Proc. SPIE 4236, Smart Electronics and MEMS II, (16 March 2001); doi: 10.1117/12.418774
Show Author Affiliations
Kuo Kang Liu, Nanyang Technological Univ. (Singapore)
Z. H. Du, National Tsing Hua Univ. (Taiwan)
F. G. Tseng, National Tsing Hua Univ. (Taiwan)
Min-Chieh Chou, Industrial Technology Research Institute (Taiwan)
J. Y. Fang, Taipei Medical College (Taiwan)
C. C. Chieng, National Tsing Hua Univ. (Singapore)


Published in SPIE Proceedings Vol. 4236:
Smart Electronics and MEMS II
Derek Abbott; Vijay K. Varadan; Karl F. Boehringer, Editor(s)

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