Share Email Print
cover

Proceedings Paper

MEMS adhesive bond degradation sensor
Author(s): Alan R. Wilson; Zouhair Sbiaa; Matt Hopcroft; Bernard C. Laskowski
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

The problem addressed in this paper is the through-life, non-destructive monitoring of corrosion and disbonding damages in airframes. The concept presented here is to produce a MEMS smart sensor consisting of a number of small, independent, wireless sensors within the structure of the aircraft. The MEMS smart sensor can be installed during repair and in particular when the specific platform goes through a complete tear down during the Life Extension Program (LEP). The sensors are permanently installed and can be permanently monitored and contain bond degradation sensing elements and CMOS circuits. Each sensor has an independent address and can perform measurements and communicate over a true 2-wire bus to an external interface unit. US ( 09/501,798) and international (PCT/US00/03308) patent applications have been lodged for this technology.

Paper Details

Date Published: 16 March 2001
PDF: 8 pages
Proc. SPIE 4236, Smart Electronics and MEMS II, (16 March 2001); doi: 10.1117/12.418764
Show Author Affiliations
Alan R. Wilson, Defence Science and Technology Organization (Australia)
Zouhair Sbiaa, Analatom Inc. (United States)
Matt Hopcroft, Analatom Inc. (United States)
Bernard C. Laskowski, Analatom Inc. (United States)


Published in SPIE Proceedings Vol. 4236:
Smart Electronics and MEMS II
Derek Abbott; Vijay K. Varadan; Karl F. Boehringer, Editor(s)

© SPIE. Terms of Use
Back to Top