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Proceedings Paper

Micromachined components for terahertz circuits and systems
Author(s): Robert E. Miles; David Paul Steenson; J. Martyn Chamberlain
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Paper Abstract

This paper discusses the need for micromachined components in very high frequency (terahertz) electronic circuits. It is shown that, with the use of micromachining, conventional rectangular rectangular technology can be scaled down to the dimensions required for these high frequency circuits. Furthermore, the fabrication techniques are capable of producing the high quality surface necessary for low loss components. Fabrication processes are presented together with the results of electrical characterisation.

Paper Details

Date Published: 16 March 2001
PDF: 8 pages
Proc. SPIE 4236, Smart Electronics and MEMS II, (16 March 2001); doi: 10.1117/12.418751
Show Author Affiliations
Robert E. Miles, Univ. of Leeds (United Kingdom)
David Paul Steenson, Univ. of Leeds (United Kingdom)
J. Martyn Chamberlain, Univ. of Leeds (United Kingdom)

Published in SPIE Proceedings Vol. 4236:
Smart Electronics and MEMS II
Derek Abbott; Vijay K. Varadan; Karl F. Boehringer, Editor(s)

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