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Proceedings Paper

Enhancement of placement accuracy for SMD via development of a new illumination system
Author(s): Kuk Won Ko; Jae Wan Kim; Hyungsuck Cho; Ki Soo Jin; Kwang Il Koh
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Paper Abstract

12 Ever since surface-mounting technology for printed circuit board (PCB) assembly processes has been developed, electrical products continuously tend toward the miniaturization of components, with denser packing of its boards. With the increasing necessity for reliable PCB product, there has been a considerable demand for high speed, high precision vision system to place the electric parts on PCB automatically. To recognize the electric parts with high accuracy and reliability, illumination condition is instrumental to acquisition of part images. In this paper, a versatile lighting is developed which utilizes three different types of illuminating methods: direct, indirect, and back-light illumination.

Paper Details

Date Published: 12 February 2001
PDF: 11 pages
Proc. SPIE 4190, Optomechatronic Systems, (12 February 2001); doi: 10.1117/12.417233
Show Author Affiliations
Kuk Won Ko, Korea Advanced Institute of Science and Technology (South Korea)
Jae Wan Kim, Korea Advanced Institute of Science and Technology (South Korea)
Hyungsuck Cho, Korea Advanced Institute of Science and Technology (South Korea)
Ki Soo Jin, Mirae Crop., Ltd. (South Korea)
Kwang Il Koh, Mirae Corp., Ltd. (South Korea)


Published in SPIE Proceedings Vol. 4190:
Optomechatronic Systems
Hyungsuck Cho; George K. Knopf, Editor(s)

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