Share Email Print
cover

Proceedings Paper

Scaling a 3D vision system from automobiles down to circuit board inspection: issues in small field-of-view inspection
Author(s): Phillip Veatch; Ender Kivanc Bas; David Stoops
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

A look at the challenges surrounding the modification of a large field of view system (6" - 18") for small field of view (~0.5") inspection in the electronics industry. Camera-based 3D systems suffer serious losses in depth of field when attempting to look at small fields of view. Off axis lens placement and careful application of the Scheimpflug Rule can significantly improve any camera-based inspection system, but these improvements may require modifications in your camera calibration procedures. A manufacturing inspection application and the improvements brought about by these techniques are discussed along with the pitfalls that were encountered along the way

Paper Details

Date Published: 12 February 2001
PDF: 12 pages
Proc. SPIE 4189, Machine Vision and Three-Dimensional Imaging Systems for Inspection and Metrology, (12 February 2001); doi: 10.1117/12.417207
Show Author Affiliations
Phillip Veatch, Intelligent Automation Systems, Inc. (United States)
Ender Kivanc Bas, The MathWorks, Inc. (United States)
David Stoops, Intelligent Automation Systems, Inc. (United States)


Published in SPIE Proceedings Vol. 4189:
Machine Vision and Three-Dimensional Imaging Systems for Inspection and Metrology
Kevin G. Harding; John W. V. Miller; Bruce G. Batchelor, Editor(s)

© SPIE. Terms of Use
Back to Top