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Proceedings Paper

McCarter superfinish grinding for silicon: an update
Author(s): Frank M. Anthony; Ali M. Khounsary; Douglas R. McCarter; S. Felix Krasnicki; Matt Tangedahl
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Paper Abstract

A grinding technique referred to as the McCarter Superfinish, for grinding large-size optical components is discussed and certain surface characterization information about flatness and the relative magnitude of the subsurface damage in silicon substrates is reported. The flatness measurements were obtained with a Wyko surface analyzer, and the substrate damage measurements were made by x-ray diffraction and acid etching. Results indicate excellent control of flatness and fine surface finish. X-ray measurements show that the diamond wheels with small particle sizes used in the final phases of the grinding operation renders surfaces with relatively small subsurface damage.

Paper Details

Date Published: 5 January 2001
PDF: 8 pages
Proc. SPIE 4145, Advances in X-Ray Optics, (5 January 2001); doi: 10.1117/12.411655
Show Author Affiliations
Frank M. Anthony, McCarter Technology, Inc. (United States)
Ali M. Khounsary, Argonne National Lab. (United States)
Douglas R. McCarter, McCarter Technology, Inc. (United States)
S. Felix Krasnicki, Argonne National Lab. (United States)
Matt Tangedahl, McCarter Technology, Inc. (United States)

Published in SPIE Proceedings Vol. 4145:
Advances in X-Ray Optics
Alan G. Michette; Andreas K. Freund; Tetsuya Ishikawa; Sebastian Oestreich; Derrick C. Mancini; Ali M. Khounsary; Derrick C. Mancini; Alan G. Michette; Sebastian Oestreich, Editor(s)

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