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Proceedings Paper

157-nm photomask handling and infrastructure: requirements and feasibility
Author(s): Jerry Cullins; Edward G. Muzio
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Paper Abstract

Photomask handling is significantly more challenging for 157nm lithography than for any previous generation of optical lithography. First, pellicle materials are not currently available which meet the requirements for 157nm lithography. Polymeric materials used at 193nm and above are not sufficiently transmissive at 157nm, while modified fused silica materials have adequate transmission properties but introduce optical distortion.

Paper Details

Date Published: 22 January 2001
PDF: 6 pages
Proc. SPIE 4186, 20th Annual BACUS Symposium on Photomask Technology, (22 January 2001); doi: 10.1117/12.410756
Show Author Affiliations
Jerry Cullins, International SEMATECH and Intel Corp. (United States)
Edward G. Muzio, International SEMATECH and Intel Corp. (United States)


Published in SPIE Proceedings Vol. 4186:
20th Annual BACUS Symposium on Photomask Technology
Brian J. Grenon; Giang T. Dao, Editor(s)

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