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Proceedings Paper

Fabrication process and transmission characteristics of SCALPEL mask blanks with thin SiNx membranes
Author(s): Sang-In Han; Pawitter J. S. Mangat; William J. Dauksher; Michael Chor; James Alexander Liddle; Anthony E. Novembre
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Paper Abstract

The SCALPEL® (Scattering with Angular Limitation Projection Electron Beam Lithography) mask technology is based on the electron-scattering properties of the patterned scatterer film present on the thin membrane material in conjunction with an aperture in the back focal plane of the projection optics of the exposure tool. Thus, the membrane material that supports the scatterer patterns should be highly transmissive, leading to more efficient utilization of source energy and reduced thermal management demands in the system, particularly in the areas above the mask. However, the fabrication of SCALPEL masks with thin membranes has been one of the most key challenges in process development. Even though 100-nm thick SiNx is currently employed as the standard thickness for SCALPEL masks, there has been a drive to explore the membrane yield for thinner SiNx films. Through optimization of the LPCVD SiNx process, we have demonstrated the fabrication of SCALPEL mask membranes with approximately 50nm thick SiNx with a repeatable yield. The measured experimental electron transmission data agrees well with the calculation from a theoretical model.

Paper Details

Date Published: 22 January 2001
PDF: 7 pages
Proc. SPIE 4186, 20th Annual BACUS Symposium on Photomask Technology, (22 January 2001); doi: 10.1117/12.410751
Show Author Affiliations
Sang-In Han, Motorola (United States)
Pawitter J. S. Mangat, Motorola (United States)
William J. Dauksher, Motorola (United States)
Michael Chor, Motorola (United States)
James Alexander Liddle, Lucent Technologies/Bell Labs. (United States)
Anthony E. Novembre, Lucent Technologies/Bell Labs. (United States)


Published in SPIE Proceedings Vol. 4186:
20th Annual BACUS Symposium on Photomask Technology
Brian J. Grenon; Giang T. Dao, Editor(s)

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