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Proceedings Paper

New approach to improve CD uniformity based on mask quality
Author(s): Roman Liebe; Carmen Jaehnert; Gidon Gottlib; Yair Eran; Shirley Hemar; Amikam Sade; Anja Rosenbusch
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Paper Abstract

CD uniformity is one of the key discussion topics in the ramp-up process of new technologies. The impact of mask quality is getting more and more attention in this process. The paper presents improving wafer CD uniformity control by application of new reticle CD qualification procedure. The new procedure is based on combining conventional CD metrology and Linewidth Bias Monitor (LBM) as a standard part of mask inspection.

Paper Details

Date Published: 22 January 2001
PDF: 7 pages
Proc. SPIE 4186, 20th Annual BACUS Symposium on Photomask Technology, (22 January 2001); doi: 10.1117/12.410673
Show Author Affiliations
Roman Liebe, Infineon Technologies AG (Germany)
Carmen Jaehnert, Infineon Technologies AG (Germany)
Gidon Gottlib, ETEC Systems, Inc., an Applied Materials Co. (Israel)
Yair Eran, ETEC Systems, Inc., an Applied Materials Co. (Israel)
Shirley Hemar, ETEC Systems, Inc., an Applied Materials Co. (Israel)
Amikam Sade, ETEC Systems, Inc., an Applied Materials Co. (Israel)
Anja Rosenbusch, ETEC Systems, Inc., an Applied Materials Co. (United States)


Published in SPIE Proceedings Vol. 4186:
20th Annual BACUS Symposium on Photomask Technology
Brian J. Grenon; Giang T. Dao, Editor(s)

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