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Proceedings Paper

Lithographic performance results for a new 50-kV electron-beam mask writer
Author(s): Varoujan Chakarian; Stephen R. Bylciw; Charles A. Sauer; David Trost; Marek Zywno; Robin Teitzel; Frederick Raymond; Frank E. Abboud
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Paper Abstract

Current pattern generation tool designs will be inadequate to meet the advanced requirements for next-generation masks, particularly at the 100 nm node. Etec Systems, Inc. has developed a complete raster-based patterning solution to provide improved resolution, critical dimension (CD) uniformity, positional accuracy, and throughput. This solution meets the challenges of the 130-nm device generation with extendibility to at least 100 nm devices. Our complete patterning solution includes an electron-beam (e-beam) pattern generation system and a new 50 kV process. The e-beam system includes a column with 50 kV accelerating voltage and a new graybeam writing technique. To accomplish this technique, a pulse-width modulated blanking system, per-pixel deflection, retrograde scanning, and multiphase and multipass writing are used. This combination of features results in markedly improved lithographic performance and enables the use of conventional high-contrast resists for faster process implementation. Additional significant innovations of this pattern generation system include a novel stage design, an integrated automated material handling system (AMHS), on-board diagnostics, and improved environmental/thermal management. We believe this comprehensive patterning solution offers the best combination of benefits to the user in terms of versatility and extendibility.

Paper Details

Date Published: 22 January 2001
PDF: 15 pages
Proc. SPIE 4186, 20th Annual BACUS Symposium on Photomask Technology, (22 January 2001); doi: 10.1117/12.410672
Show Author Affiliations
Varoujan Chakarian, Etec Systems, Inc., an Applied Materials Co. (United States)
Stephen R. Bylciw, Etec Systems, Inc., an Applied Materials Co. (United States)
Charles A. Sauer, Etec Systems, Inc., an Applied Materials Co. (United States)
David Trost, Etec Systems, Inc., an Applied Materials Co. (United States)
Marek Zywno, Etec Systems, Inc., an Applied Materials Co. (United States)
Robin Teitzel, Etec Systems, Inc., an Applied Materials Co. (United States)
Frederick Raymond, Etec Systems, Inc., an Applied Materials Co. (United States)
Frank E. Abboud, Etec Systems, Inc., an Applied Materials Co. (United States)


Published in SPIE Proceedings Vol. 4186:
20th Annual BACUS Symposium on Photomask Technology
Brian J. Grenon; Giang T. Dao, Editor(s)

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