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Proceedings Paper

Real-time yield checks at wafer test
Author(s): Enrique Rodriguez; Carlos Cano; Javier Sanchez-Vicente; Julian Moreno
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Paper Abstract

In this work, we describe some of the problems that can affect the yield at Wafer Probe, and at the checks performed by a software that we have developed to ensure the good quality of the wafer probing. Most of the problems at Wafer Probe appear in the same way and by detecting their pattern, even not knowing the exact source of the problem, we can prevent the product and its yield form being affected. The most common patterns of failures are: a certain category failing consecutively, a certain test failing above statistical limits expected, based on the historical results of that product, same wafers yielding different in two different testers, and results in a lot going worse wafer by wafer. For addressing these issues, we run in real time a set of programs at the end of every wafer tested. These programs generate alarms and tell actions to the operator when the above problems are detected.

Paper Details

Date Published: 23 August 2000
PDF: 7 pages
Proc. SPIE 4182, Process Control and Diagnostics, (23 August 2000); doi: 10.1117/12.410098
Show Author Affiliations
Enrique Rodriguez, Lucent Technologies (Spain)
Carlos Cano, Lucent Technologies (Spain)
Javier Sanchez-Vicente, Lucent Technologies (Spain)
Julian Moreno, Lucent Technologies (Spain)


Published in SPIE Proceedings Vol. 4182:
Process Control and Diagnostics
Michael L. Miller; Kaihan A. Ashtiani, Editor(s)

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