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Proceedings Paper

Maturity assessment of 300-mm etch equipment
Author(s): Karl E. Mautz; Thomas Morgenstern
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Paper Abstract

Oxide and dielectric etch, polysilicon etch, and metal etch, in situ strip and stand-alone ash processes for 300mm wafers were developed on a tool ste in SEMICONDUCTOR300 and tested for robustness using a 0.25(mu) 64Mb DRAM device. The process recipes were developed from reference scaled-up recipes. The oxide and dielectric etch tools used magnetically-enhanced reactive ion etching. They polysilicon etch tool chambers were high density plasma configurations. The metal etch tools used high-density plasma chambers and have an in-line resist strip module to prevent corrosion. Stand-alone ash tools were used for all other photoresist strip processes. For each application, at least two 300mm tools from different suppliers were tested. This paper discusses process and tool interactions affecting operational robustness and stability. Process and hardware evaluations were also done during extensibility testing using smaller linewidth features.

Paper Details

Date Published: 23 August 2000
PDF: 8 pages
Proc. SPIE 4182, Process Control and Diagnostics, (23 August 2000); doi: 10.1117/12.410092
Show Author Affiliations
Karl E. Mautz, Semiconductor300 GmbH & Co. KG (United States)
Thomas Morgenstern, Semiconductor300 GmbH & Co. KG (Germany)

Published in SPIE Proceedings Vol. 4182:
Process Control and Diagnostics
Michael L. Miller; Kaihan A. Ashtiani, Editor(s)

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