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Proceedings Paper

Discolored bondpads caused by aluminum hydroxide formation
Author(s): Zong Min Wu; Chong Khiam Oh; Soh Ping Neo; Shailesh Redkar
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Paper Abstract

Discolored bondpads and poor adhesion or non-stick failure during bonding was investigated. The bondpads looked either brown in color at corners or just discolored without brownish corners. SEM inspection showed such bondpads had porous surface that was worse at corners. EDX, FIB and Auger Electron Spectroscopy (AES) were used to analyze and identify the root cause. Failure analysis showed that the discolored bondpads were caused by the formation of aluminum hydroxide. This process was an oxidation or corrosion process that could not be avoided when bondpads were exposed to atmospheric environment. EDX analysis further confirmed the existence of Al-O chemical bonding. FIB/SEM analysis showed clearly the porous layer grew thicker towards the bondpad edge by consuming more aluminum. The layer of aluminum hydroxide on the bondpads created a barrier for good bonding. It is the responsibility of both fab and assembly plant to take preventative action to avoid the excessive exposure of bondpads to moisture during manufacturing.

Paper Details

Date Published: 23 August 2000
PDF: 8 pages
Proc. SPIE 4182, Process Control and Diagnostics, (23 August 2000); doi: 10.1117/12.410086
Show Author Affiliations
Zong Min Wu, Chartered Semiconductor Manufacturing, Ltd. (Singapore)
Chong Khiam Oh, Chartered Semiconductor Manufacturing, Ltd. (Singapore)
Soh Ping Neo, Chartered Semiconductor Manufacturing, Ltd. (Singapore)
Shailesh Redkar, Chartered Semiconductor Manufacturing, Ltd. (Singapore)


Published in SPIE Proceedings Vol. 4182:
Process Control and Diagnostics
Michael L. Miller; Kaihan A. Ashtiani, Editor(s)

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